[Suzhou / Anhui, China — Sep.21, 2026] — As global artificial intelligence (AI) workloads and next-generation data center architectures demand unprecedented optical bandwidth, high-density optical interconnect solutions have become essential to unlocking system performance. OECE Technology, a global leader in high-precision optical interconnect components, today officially announced that its proprietary 36-fiber (36f) Fiber Array Unit (FAU) platform has completed full process qualification and comprehensive reliability verification. Achieving high-yield mass production, this milestone establishes a robust supply chain foundation for co-packaged optics (CPO) and near-packaged optics (NPO) deployments.

High-core-count FAUs serve as critical optical coupling engines in CPO and NPO architectures. However, mass production has historically been hindered by multi-channel pitch drift, cure-induced thermal strain, and insertion loss (IL) instability under environmental stress.

Leveraging deep expertise in ultra-precision manufacturing, OECE has achieved systematic breakthroughs across its entire assembly line—from micro-machined V-groove substrates to automated sub-micron alignment, stress-controlled curing, and nano-level end-face polishing:

• Versatile Structural Designs: Available in both lidded and lidless form factors to seamlessly integrate with diverse optical engine packaging requirements.
• Hybrid Fiber Arrays & Polarization Coupling: Fully supports mixed single-mode (SM) and polarization-maintaining (PM) fiber layouts, precisely meeting External Laser Source (ELS) polarization requirements.
• Telcordia-Grade Reliability: Fully compliant with Telcordia GR-468-CORE standards across environmental, mechanical, and thermal stress tests.

Empirical Mass Production Yield Benchmarks (Based on 3,600 Measured Cores)

To demonstrate commercial readiness and process maturity, OECE evaluated a random sample of 100 production units (3,600 total fiber channels), delivering industry-leading spatial alignment accuracy:

• X-Axis Horizontal Accuracy: Achieved 99.8% yield (with over 96.0% achieving sub-micron precision).
• Y-Axis Vertical Alignment: Achieved 99.4% yield (with over 92.0% achieving sub-micron precision).
• Composite (X,Y) Positional Accuracy: Reached 88.0% yield at ≤0.5μm, and 100.0% yield at ≤0.7μm.

OECE provides global partners with complete supply chain transparency and scalable production capacity:

• Base Capacity: Total FAU capacity expanded from 1.3 million units/month in December 2025 to 3.0 million units/month by June 2026, covering high precision 8f, 12f, and 16f lines.
• 36f FAU Ramp: Dedicated 36f FAU assembly is targeted to reach 10,000 units/day by March 2027.

2.Next-Generation High-Density Roadmap: Active development is underway for 54-fiber and 72-fiber ultra-high-density arrays.

3.Integrated CPO/NPO Cable Solutions: Building on its upcoming MMC connector qualification in November 2026, OECE will launch fully integrated CPO/NPO FAU-MMC Cable Assemblies in 2027.

OECE’s 36f FAU assemblies are currently undergoing system-level qualification with leading global hyperscale data centers and transceiver manufacturers.

"From microns to sub-microns, every step in precision reflects OECE's commitment to excellence in optical manufacturing," said Guangbing Liu, GM of OECE. "Achieving high-yield volume production for 36-fiber FAUs marks a major milestone in our silicon photonics strategy. Moving forward, we will continue collaborating closely with global supply chain partners, providing the reliable, high-density interconnect solutions required for next-generation computing infrastructure."

OECE Technology is a specialized provider of next-generation optical interconnect devices, supporting 400G, 800G, and 1.6T optical transceivers and silicon photonics CPO/NPO architectures. Machining with ultra-precision machining capabilities and highly automated production facilities, OECE delivers high-density, low-loss, and cost-effective optical solutions to data centers, AI computing clusters, and telecom operators worldwide.